Description
R5 bin White Cree LED
| Part Number: XPGWHT-L1-0000-00H53 – Characteristics | ||||||||
|---|---|---|---|---|---|---|---|---|
| PARAMETER | UNIT | TYPICAL | MAXIMUM | |||||
| Thermal resistance, junction to solder point | °C/W | 6 | ||||||
| Viewing angle (FWHM) | degrees | 125 | ||||||
| Temperature coefficient of voltage | mV/°C | -2.1 | ||||||
| ESD classification (HBM per Mil-Std-883D) | Class 2 | |||||||
| DC forward current | mA | 1500 | ||||||
| Reverse Voltage | V | 5 | ||||||
| Forward voltage (@ 350 mA) | V | 3.0 | 3.75 | |||||
| Forward voltage (@ 700 mA) | V | 3.2 | ||||||
| Forward voltage (@ 1000 mA) | V | 3.3 | ||||||
| LED junction temperature | °C | 150 | ||||||
| Flux Characteristics (TJ = 25°C) | ||||||||
| Color | CCT Range | Lumens | ||||||
| Cool White | 5,000k-8,300k | 139 | ||||||
| Soldering Characteristics | ||||||||
|---|---|---|---|---|---|---|---|---|
| Profile Feature | Lead-Based Solder | Lead-Free Solder | ||||||
| Average Ramp-Up Rate (Tsmax to Tp) | 3°C/second max. | 3°C/second max. | ||||||
| Preheat: Temperature Min (Tsmin) | 100°C | 150°C | ||||||
| Preheat: Temperature Max (Tsmax) | 150°C | 200°C | ||||||
| Preheat: Time (tsmin to tsmax) | 60-120 seconds | 60-180 seconds | ||||||
| Time Maintained Above: Temperature (TL) | 183°C | 217°C | ||||||
| Time Maintained Above: Time (tL) | 60-150 seconds | 60-150 seconds | ||||||
| Peak/Classification Temperature (Tp) | 215°C | 260°C | ||||||
| Time Within 5°C of Actual Peak Temperature (tp) | 10-30 seconds | 20-40 seconds | ||||||
| Ramp-Down Rate | 6°C/second max. | 6°C/second max | ||||||
| Time 25°C to Peak Temperature | 6 minutes max. | 8 minutes max. | ||||||
| Note: All temperatures refer to topside of the package, measured on the package body surface. | ||||||||
